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Semiconductor · MU
Micron
70
Exposed
EO 14415 Readiness · 0–100
Micron's NY and ID fab investments improve domestic wafer posture. Advanced packaging and substrates remain the offshore choke point across the industry.
Primary exposure
US memory fab expansion strong; packaging remains offshore.
Sub-scores
Materials65
FOCI78
Domestic74
BOM62
Top critical-material exposures
Elevated risk
Rare Gases
DRAM/NAND process gases.
Elevated risk
Advanced Packaging Substrates
Asia-concentrated.
Elevated risk
Photoresists
Japanese-concentrated.
Private assessment for Micron
XTRIUM validates this score at sub-tier depth against your actual BOMs, POs, and program data.