Intel's Ohio, Arizona, and New Mexico fab expansion gives it the deepest domestic wafer capacity of any listed company. Upstream specialty gases and photoresists are the remaining choke point.
Primary exposure
US fab expansion strengthens domestic posture; upstream gases remain choke point.
Sub-scores
Materials68
FOCI80
Domestic82
BOM66
Top critical-material exposures
Elevated risk
Neon / Krypton / Xenon
Lithography; Ukraine exposure historical.
Elevated risk
Photoresists
Japanese-concentrated; allied but concentrated.
Moderate risk
Gallium
Compound semis and packaging.
Private assessment for Intel
XTRIUM validates this score at sub-tier depth against your actual BOMs, POs, and program data.